Replaceable probe apparatus for probing semiconductor wafer

ABSTRACT

A probe apparatus for probing a device on a semiconductor wafer to be tested by a testing equipment is provided. The probe apparatus includes a replaceable probe tile removably mounted in a probing location on a base plate. The probe tile is configured into a self-contained assembly which includes a chassis body containing a plurality of probes for probing devices on a wafer, a dielectric block for supporting the probes, and a wireguide for guiding a plurality of cables from the testing equipment into the chassis body. A wafer station having replaceable base plates and replaceable probe tiles are also provided.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation of U.S. application Ser. No.11/216,757 filed Aug. 31, 2005 and entitled “REPLACEABLE PROBE APPARATUSFOR PROBING SEMICONDUCTOR WAFER,” which claims the benefit of priorityof U.S. Provisional Patent Application Nos. 60/606,994, 60/607,013 and60/607,062 each of which was filed Sep. 3, 2004, and is related to U.S.Utility patent application Ser. No. 09/730,130, filed Dec. 4, 2000 andissued as U.S. Pat. No. 6,586,954, U.S. Utility patent application Ser.No. 10/601,764 filed Jun. 23, 2003 and issued as U.S. Pat. No.6,882,168, U.S. Utility patent application Ser. No. 09/021,631 filedFeb. 10, 1998 and issued as U.S. Pat. No. 6,201,402, U.S. Utility patentapplication Ser. No. 10/607,768 filed Jun. 27, 2003 and issued as U.S.Pat. No. 6,992,495, U.S. Utility patent application Ser. No. 10/383,079filed Mar. 6, 2003 and issued as U.S. Pat. No. 6,963,207, U.S. Utilitypatent application Ser. No. 10/809,051 filed Mar. 25, 2006 and issued asU.S. Pat. No. 6,975,128, each of which is incorporated herewith byreference in their entirety.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor testingequipment, and more particularly, to a probe apparatus used insemiconductor testing equipment for electrically probing devices on asemiconductor wafer.

BACKGROUND OF THE INVENTION

The semiconductor industry has a need to access many electronic deviceson a semiconductor wafer. As the semiconductor industry grows anddevices become more complex, many electrical devices, most commonlysemiconductor devices, must be electrically tested, for example, forleakage currents and extremely low operating currents. These currentsare often below 100 fA. In addition, the currents and devicecharacteristics are often required to be evaluated over a widetemperature range to understand how temperature affects a device.

Also, the electronic devices are often placed on wafers in differentlocations due to different die sizes. Additionally, due to the widevariety of die pitches (referring to the spacing between adjacentdevices on a die/wafer or the corresponding spacing between adjacentprobe tiles on a probe tile plate (or sometimes referred to as “baseplate”), users need the flexibility of reusing the probe tiles invarious base plates. The size of a die pitch may vary, for example, from10 mm² to 30 mm², etc. Further, the shape of a die pitch may vary aswell, for example, a rectangular shape, a square shape, etc. At present,semiconductor testing equipment is designed such that a user has to usedifferent probe tiles if the size or shape of die pitches on a die/waferis different.

Accordingly, to effectively measure these devices, there is a need for acompact, probe apparatus having a plurality of probe tiles for probingdevices whereby the probe tiles can be mounted in a new location andprovides new versatility and capability. Further, there is a need forimproved semiconductor testing equipment for electrically probingsemiconductor devices at low currents, over a wide temperature range.

SUMMARY OF THE INVENTION

To solve the above and the other problems, the present inventionprovides a probe apparatus for testing semiconductor devices on a wafercomprising replaceable probe tiles.

In one embodiment, a replaceable probe tile is configured into aself-contained assembly. The assembly includes a chassis body thatcontains a plurality of probes for probing devices on a wafer, a ceramicdielectric block for supporting the probes, at least one wireguide forguiding a plurality of cables from an external testing equipment intothe chassis body, and a plurality of electrical connections forconnecting the probes to the cables received in the chassis body. Theprobe tile is removably mounted in a precise location on a base plate byusing a guide mechanism. A user can remove the probe tile and place itinto a different location or slot on the base plate to accommodatedifferent die pitches.

Still in one embodiment, the assembly further includes a top cover, aspacer disposed between the wireguide and the chassis body, and a bottomcover. The wireguide includes a plurality of access slots on its sidewalls for receiving the cables and having a bore for directing thecables from the external testing equipment to the devices on the wafer.

Further in one embodiment, the guide mechanism includes a modularadapter which can be used to receive a variety of base plates and adaptto a variety of probe stations for testing devices on a semiconductorwafer. The guide mechanism includes a plurality of knobs and/or othermeans of adjusting planetary and/or tilting angles of the base plate sothat the base plate aligns with a wafer on the wafer station for preciseprobing and testing. The guide mechanism may also include an interfacemember configured and arranged to fit the base plate in the modularadapter for different probe stations.

Additionally in one embodiment, the base plate includes at least oneprobe tile slot for receiving the probe tile, and a locating mechanismfor providing a precise location for the probe tile to test the deviceon the wafer.

Yet in one embodiment of the present invention, a replaceable probe tileis mounted on a distal end of a manipulator of a probing apparatus forelectrically testing semiconductor devices on a wafer. Each probe tileis a self-contained unit and removable from the respective manipulatorfor re-use. Accordingly, multiple devices on the wafer can be testedsimultaneously, and different sets of devices on the wafer can be testedafter replacing at least some of the probe tiles.

In another embodiment of the present invention, replaceable probe tilesare mounted on a probe tile plate or base plate for testingsemiconductor devices on a wafer. The base plate can be replaced foradapting to a wafer with different die pitches. The probe tiles areremovable from the base plate for re-use.

In yet another embodiment of the present invention, the replaceableprobe tiles are mounted on a stand-alone wafer station. The waferstation includes an enclosure for housing a replaceable base plate and aplurality of probe tiles removably mounted on the base plate.

These and other advantages of the present invention will become apparentto those skilled in the art from the following detailed description,wherein it is shown and described illustrative embodiments of theinvention, including best modes contemplated for carrying out theinvention. As it will be realized, the invention is capable ofmodifications in various obvious aspects, all without departing from thespirit and scope of the present invention. Accordingly, the drawings anddetailed description are to be regarded as illustrative in nature andnot restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a perspective view of one embodiment of a replaceableprobe tile of a probing apparatus in accordance with the principles ofthe present invention.

FIG. 2 illustrates a bottom view of one embodiment of a replaceableprobe tile of a probing apparatus in accordance with the principles ofthe present invention.

FIG. 3 illustrates a perspective view of one embodiment of a probingapparatus having a probe tile enclosed therein, in accordance with theprinciples of the present invention.

FIG. 4 illustrates a perspective view of one embodiment of a probe tilemounted on a distal end of a manipulator of a probing apparatus inaccordance with the principles of the present invention.

FIG. 5 illustrates an exploded view of the probe tile as shown in FIG. 4except with a top cover thereon.

FIG. 6 illustrates an exploded view of the probe tile as shown in FIG. 1except with a bottom cover thereon.

FIG. 7 illustrates a perspective view of one embodiment of a chassisbody of the probe tile as shown in FIG. 6.

FIG. 8 illustrates a perspective, partial view of a base plate having aplurality of probing locations or slots, and a chassis body as shown inFIG. 7 that is removable from one of the probing locations in accordancewith the principles of the present invention.

FIG. 9 illustrates a perspective view of one embodiment of a probe tilemounted on a manipulator of a probing apparatus as shown in FIG. 4.

FIG. 10 illustrates a top view of one embodiment of a probing apparatushaving a plurality of manipulators as shown in FIG. 9.

FIG. 11 a illustrates a perspective, partially exploded view of aprobing apparatus showing a probe tile to be mounted on a base plate tobe housed in and adjusted by a modular adapter in accordance with theprinciples of the present invention.

FIG. 11 b illustrates a perspective, partially exploded view of aprobing apparatus showing the probe tile of FIG. 11 a to be mounted on adifferent base plate in accordance with the principles of the presentinvention.

FIG. 11 c illustrates a perspective, partially exploded view of aprobing apparatus showing the probe tile of FIG. 11 a to be mounted onyet another base plate or probe card and then on an interface member tobe housed in and adjusted by a modular adapter in accordance with theprinciples of the present invention.

FIG. 12 illustrates a perspective, partially exploded view of oneembodiment of a base plate having a plurality of removable probe tilesin accordance with the principles of the present invention.

FIG. 13 illustrates a perspective view of another embodiment of a baseplate having a removable probe tile in accordance with the principles ofthe present invention.

FIG. 14 illustrates a perspective view of one embodiment of a waferstation housing a replaceable base plate and a plurality of removableprobe tiles in accordance with the principles of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides a probe apparatus having a replaceableprobe tile, for testing a device on a semiconductor wafer. FIG. 1illustrates one embodiment of a replaceable probe tile 100. The probetile 100 is configured into a self-contained assembly. As shown in FIGS.1-7, the assembly includes a chassis body 102 that contains a pluralityof probes 104 for probing devices on a semiconductor wafer (not shown),a ceramic dielectric block 106 for supporting the probes 104, at leastone wireguide 108 for guiding a plurality of cables 110 from an externaltesting equipment into the chassis body 102, and a plurality ofelectrical connections (not shown) for connecting the probes 104 to thecables 110 received in the chassis body 102.

As shown in FIG. 8, the probe tile 100 is removably mounted on a baseplate 112. For the purpose of illustration, only the chassis body 102 isshown to be disposed on top of one of locations or slots 114 in the baseplate 112. Further, the chassis body 102 can be mounted at a preciselocation on the base plate 112 by using a guide mechanism 116, and anexample of which is shown in FIGS. 11 a-11 c (see detailed below). Auser can remove the probe tile 100 and place it into a differentlocation 118 of a different base plate 120 to accommodate different diepitches. It will be appreciated that a replaceable probe tile 100 canalso be placed in a different location of the same base plate 110.

In FIGS. 1-8, the assembly of the probe tile 100 further includes a topcover 122, a spacer 124 disposed between the wireguide 108 and thechassis body 102, and a bottom cover 126 (see FIG. 6). The wireguide 108includes a plurality of access slots 128 on its side walls 129 forreceiving the cables 110 and having a bore 130 for directing the cables110 from the external testing equipment to the devices on the wafer.

As shown in FIGS. 3-5 and 9-10, the probe tile 100 is mounted on a baseplate 132 which is coupled to a distal end 134 of a manipulator arm 136of a probing apparatus as shown in FIG. 10. Also, a protective top cover138 is shown in FIG. 3 to protect and shield the probe tile 100.

It will be appreciated to a person skilled in the art that a pluralityof wireguides 108 can be used in the assembly to provide additionalaccess for the cables 110 as shown in FIGS. 1, 4-6, and 9. Also, aflexible O-ring strain relief 140 is disposed between the wireguides108. Additional flexible O-ring strain relief 140 can be used betweenthe top cover 122 and the wireguide 108.

In FIG. 7, the chassis body 102 includes a split ring collet mechanism144 and at least one slotted locating hole 148. When captive flat headscrews 151 (see FIG. 6) are tightened, a countersink 153 forces a splitring 155 apart precisely locating the chassis body 102 in a base plate.The slotted locating holes 148 lock the rotational position of thechassis body 102. An orientation notch 157 may also be provided forvisual orientation. Accordingly, the chassis body 102 can be mounted onan indexable base plate so as to provide a precise location for theprobe tiles 100 to test the devices on the wafer. As shown in FIG. 8, aplurality of indexable location pins 146 that correspond with locatingholes 148 are disposed on the base plate 112. Also as shown, the baseplate 112 includes a plurality of probing locations or slots 114 forreceiving removable probe tiles 100.

As shown in FIGS. 11 a-11 c, the guide mechanism 116 includes a modularadapter 150 which can be used to receive a variety of base plates 112,120, and 156. The guide mechanism 116 includes a plurality of knobs 152and/or any other suitable means of adjusting planetary and/or tiltingangles of the base plate so that the base plate aligns with a wafer onthe wafer station for precise probing and testing. The guide mechanism116 may also include an interface member 154 configured and arranged tofit the base plate 156 in the modular adapter 150 for different probestations.

In FIG. 12, replaceable probe tiles 100 are mounted on a base plate 158for testing semiconductor devices on a wafer. The base plate 158 can bereplaced by another base plate, for adapting to a wafer with differentdie pitches, for example, a base plate 160 as shown in FIG. 13. Theprobe tiles 100 are removable from the base plate 158 for re-use in thebase plate 160.

In FIG. 14, the replaceable probe tiles are mounted on a stand-alonewafer station 162. The wafer station 162 includes an enclosure 164 forhousing a replaceable base plate 166 and a plurality of probe tiles 168removably mounted on the base plate 166.

The numerous innovative teachings of the present application will bedescribed with particular reference to the presently preferredembodiments, wherein these innovative teachings are advantageouslyapplied to the particular problems of a probe apparatus for measuringlow currents with a wide operating temperature range in probing asemiconductor device. However, it should be understood that theseembodiments are only examples of the many advantageous uses of theinnovative teachings herein. In general, statements made in thespecification of the present application do not necessarily limit any ofthe various claimed inventions. Moreover, some statements may apply tosome inventive features but not to others. In general, unless otherwiseindicated, singular elements may be in the plural and visa versa with noloss of generality.

The following terms are particularly described throughout thedescription:

Semiconductor Device not Limitive

The present invention is particularly suitable for probing semiconductordevices, but the use of the present teachings is not limited to probingsemiconductor devices. Other devices, such as biological devices, may beapplied to the present invention teachings. Thus, while thisspecification speaks in terms of probing ‘semiconductor’ devices, thisterm should be interpreted broadly to include probing any suitabledevice.

Low Current not Limitive

The present invention solves the problem of measuring currents below 100fA, but the current range of the present teachings is not limited tobelow 100 fA. For example, the present invention may be applied tomeasure the currents at or above 100 fA in a semiconductor device. Thus,while this specification speaks in terms of ‘low currents’ or ‘measuringcurrents below 100 fA’, these terms should be interpreted broadly toinclude any current that flows through a semiconductor device whichcould be at or above 100 fA.

Wide Temperature not Limitive

The present invention solves the problem of measuring currents of asemiconductor device in a narrow or limited operating temperature range.The present teachings do not limit to a specific operating temperaturerange. The present application allows a tester to electrically probesemiconductor devices over a wide operating temperature range, not onlyat a low operating temperature but also a high operating temperature,e.g. an operating temperature up to 300 C and beyond. Thus, while thisspecification speaks in terms of ‘wide temperature range’ or ‘measuringcurrents in a wide operating temperature range’, these terms should beinterpreted broadly to include any suitable operating or testingtemperature range of a semiconductor device.

Size not Limitive

The present invention solves the problem of measuring currents andvoltages of a semiconductor device using a compact probing apparatus.However, nothing in the teachings of the present invention limitsapplication of the teachings of the present invention to a larger orsmaller probe apparatus. Advantageous use of the teachings of thepresent invention may be had with a probe apparatus of any size.

Materials not Limitive

Throughout the discussion herein there will be examples provided thatmake reference to materials, such as ceramic, in regards to dielectricblock. The present invention does not recognize any limitations inregards to what types of materials may be used in affecting theteachings of the present invention. One skilled in the art willrecognize that any suitable material may be used with no loss ofgenerality in implementing the teachings of the present invention.

From the above description and drawings, it will be understood by thoseof ordinary skill in the art that the particular embodiments shown anddescribed are for purposes of illustration only and are not intended tolimit the scope of the present invention. Those of ordinary skill in theart will recognize that the present invention may be embodied in otherspecific forms without departing from its spirit or essentialcharacteristics. References to details of particular embodiments are notintended to limit the scope of the invention.

1. A replaceable probing apparatus which receives at least one probetile for probing a device on a semiconductor wafer to be tested by atesting equipment, the replaceable probing apparatus comprising: a probetile plate, including: at least one probing slot through the probe tileplate from a main surface and an opposite surface of the probe tileplate for receiving the at least one probe tile; and a plurality oflocation pins adjacent the at least one probing slot, configured toprovide a location for the at least one probe tile on the probe tileplate and configured to lock a rotational position of the at least oneprobe tile with respect to the probe tile plate on the main surface; anda guide mechanism configured to adjust a tilting angle of the probe tileplate so that the probe tile aligns with the semiconductor wafer to betested.
 2. The replaceable probing apparatus of claim 1, wherein theguide mechanism comprises a plurality of knobs for adjusting a tiltingangle of the probe tile plate.
 3. The replaceable probing apparatus ofclaim 1, wherein the guide mechanism comprises an adapter to receive theprobe tile plate.
 4. The replaceable probing apparatus of claim 3,wherein the guide mechanism comprises an interface member configured andarranged to fit the probe tile plate in the adapter.
 5. The replaceableprobing apparatus of claim 1, wherein the probing slot is a through holefor allowing the at least one probe tile to be inserted therein.
 6. Thereplaceable probing apparatus of claim 1, wherein the location pins eachextend generally perpendicular away from the main surface of the probetile plate.